EJOT TSSD® - Technology

The trend subject "lightweight design" was a central starting point of development activities for fastening solutions of sandwich material such as honeycomb and foam structures and their diverse coatings.

With the thermal adhesive bonding boss TSSD® EJOT developed a product and the corresponding process, to join components made of these materials in a reliable way and with outstanding strength properties. Thus, the TSSD® is the perfect solution for applications in honeycomb- and foam materials which are a standard in aircraft interiors.

Function of the TSSD®: 

 The TSSD® is accelerated by the tooling equipment to a specified rotational speed and is pushed into the upper layer by a defined forward feed.

• The partly fused TSSD® element then penetrates the component and "flows" into the hollow chambers of the intermediate layer, forming a positive locked and adhesive bonding.
• The TSSD® rotates till the final position is reached, where it stops immediately. The tooling equipment still performs an axial pressure onto the TSSD®  to give the fused polymer mass parts of the layers and cores are embedded and a positive locking and adhesive bonding is created.